Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 21204 | 369 | 22.7 | 46% |
Classes in level above (level 2) |
| ID, lev. above |
Publications | Label for level above |
|---|---|---|
| 688 | 12395 | LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | TIN WHISKER | Author keyword | 54 | 72% | 11% | 42 |
| 2 | TIN WHISKERS | Author keyword | 50 | 71% | 11% | 40 |
| 3 | SN WHISKER | Author keyword | 23 | 72% | 5% | 18 |
| 4 | WHISKER GROWTH | Author keyword | 17 | 63% | 5% | 17 |
| 5 | SN WHISKERS | Author keyword | 17 | 75% | 3% | 12 |
| 6 | METAL WHISKERS | Author keyword | 8 | 100% | 1% | 5 |
| 7 | TIN PLATING | Author keyword | 6 | 36% | 4% | 14 |
| 8 | IMPLEMENTAT PROD | Address | 4 | 67% | 1% | 4 |
| 9 | TIN ELECTROPLATING | Author keyword | 4 | 67% | 1% | 4 |
| 10 | ELECTROPLATED TIN | Author keyword | 4 | 75% | 1% | 3 |
Web of Science journal categories |
Author Key Words |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | TIN WHISKER | 54 | 72% | 11% | 42 | Search TIN+WHISKER | Search TIN+WHISKER |
| 2 | TIN WHISKERS | 50 | 71% | 11% | 40 | Search TIN+WHISKERS | Search TIN+WHISKERS |
| 3 | SN WHISKER | 23 | 72% | 5% | 18 | Search SN+WHISKER | Search SN+WHISKER |
| 4 | WHISKER GROWTH | 17 | 63% | 5% | 17 | Search WHISKER+GROWTH | Search WHISKER+GROWTH |
| 5 | SN WHISKERS | 17 | 75% | 3% | 12 | Search SN+WHISKERS | Search SN+WHISKERS |
| 6 | METAL WHISKERS | 8 | 100% | 1% | 5 | Search METAL+WHISKERS | Search METAL+WHISKERS |
| 7 | TIN PLATING | 6 | 36% | 4% | 14 | Search TIN+PLATING | Search TIN+PLATING |
| 8 | TIN ELECTROPLATING | 4 | 67% | 1% | 4 | Search TIN+ELECTROPLATING | Search TIN+ELECTROPLATING |
| 9 | ELECTROPLATED TIN | 4 | 75% | 1% | 3 | Search ELECTROPLATED+TIN | Search ELECTROPLATED+TIN |
| 10 | LEADFRAME PACKAGE | 4 | 75% | 1% | 3 | Search LEADFRAME+PACKAGE | Search LEADFRAME+PACKAGE |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | TIN WHISKERS | 77 | 67% | 19% | 70 |
| 2 | SN WHISKERS | 24 | 82% | 4% | 14 |
| 3 | TIN WHISKER | 17 | 79% | 3% | 11 |
| 4 | SPONTANEOUS GROWTH | 14 | 55% | 5% | 17 |
| 5 | HILLOCK | 11 | 69% | 2% | 9 |
| 6 | SN CU | 7 | 34% | 4% | 16 |
| 7 | DYNAMIC RECRYSTALLIZATION DRX | 6 | 100% | 1% | 4 |
| 8 | WHISKER FORMATION | 3 | 50% | 1% | 4 |
| 9 | TIN WHISKER GROWTH | 2 | 44% | 1% | 4 |
| 10 | WHISKER GROWTH | 2 | 15% | 4% | 14 |
Journals |
Reviews |
| Title | Publ. year | Cit. | Active references | % act. ref. to same field |
|---|---|---|---|---|
| Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms | 2013 | 13 | 91 | 81% |
| Annotated tin whisker bibliography and anthology | 2005 | 97 | 15 | 80% |
| Tin whisker growth from electroplated finishes - a review | 2013 | 3 | 21 | 95% |
| Zinc whisker growth from electroplated finishes - a review | 2015 | 0 | 10 | 80% |
| Spontaneous Growth of Metal Whiskers on Surfaces of Solids: A Review | 2015 | 0 | 109 | 72% |
| Mechanism and prevention of spontaneous tin whisker growth | 2005 | 10 | 12 | 50% |
| The role of dissolved hydrogen and other trace impurities on propensity of tin deposits to grow whiskers | 2008 | 5 | 6 | 33% |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | IMPLEMENTAT PROD | 4 | 67% | 1.1% | 4 |
| 2 | MAT SEMICOND STRUCT | 3 | 57% | 1.1% | 4 |
| 3 | AUTOMOT ELECT ENGN ASSEMBLY INTERCONNECT TECHNOL | 3 | 100% | 0.8% | 3 |
| 4 | CORROS STUDIES | 2 | 67% | 0.5% | 2 |
| 5 | PACKAGING FINISHING TECHNOL | 2 | 67% | 0.5% | 2 |
| 6 | ISG GRP | 1 | 100% | 0.5% | 2 |
| 7 | MARITIME MISSION | 1 | 100% | 0.5% | 2 |
| 8 | METALL MAT PROC SECT | 1 | 100% | 0.5% | 2 |
| 9 | ORBITER SUSTAINING ENGN OFF | 1 | 100% | 0.5% | 2 |
| 10 | PROD ASSURANCE SAFETY | 1 | 50% | 0.3% | 1 |
Related classes at same level (level 1) |
| Rank | Relatedness score | Related classes |
|---|---|---|
| 1 | 0.0000173522 | LEAD FREE SOLDER//PB FREE SOLDER//LEAD FREE SOLDERS |
| 2 | 0.0000165923 | TIN ELECTRODEPOSITION//CONNECTING RELIABILITY//POLYETHER LAPROL |
| 3 | 0.0000115693 | ELECTROCHEMICAL MIGRATION//MECHANICAL RELIABILITY PREDICTION//CONDUCTIVE ANODIC FILAMENT |
| 4 | 0.0000092376 | IMPRESSION CREEP//INDENTATION CREEP TESTING//IMPRESSION TEST |
| 5 | 0.0000072239 | KUDAMATSU PLANT//NICKEL TIN//THERMAL EQUILIBRIUM DIAGRAM |
| 6 | 0.0000060940 | HEAT TRANSFER INSTABILITY//INDIUM JOINT//INFRARED IR EMISSIONS |
| 7 | 0.0000047455 | TINPLATE//MAT PROC TERMOMECAN//ESCUELA MECAN |
| 8 | 0.0000042557 | JOURNAL OF ELECTRONIC PACKAGING//SOLDERING & SURFACE MOUNT TECHNOLOGY//SOLDER JOINT |
| 9 | 0.0000039507 | ELECTROMIGRATION//STRESS INDUCED MIGRATION//PRC MER |
| 10 | 0.0000037653 | CRYSTAL APPROXIMANT//QUASICRYSTAL APPROXIMANT//QUASICRYSTAL APPROXIMANTS |