Class information for:
Level 1: FLUXLESS BONDING//AU SN SOLDER//MAT MFG TECHNOL PROGRAM

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
20212 408 16.9 45%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
688 12395 LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 FLUXLESS BONDING Author keyword 12 53% 4% 16
2 AU SN SOLDER Author keyword 7 64% 2% 7
3 MAT MFG TECHNOL PROGRAM Address 6 100% 1% 4
4 FLUXLESS SOLDERING Author keyword 3 29% 2% 10
5 INTERDIFFUSION IN NANOSCALE SOLIDS Author keyword 3 100% 1% 3
6 FLUXLESS Author keyword 2 24% 2% 8
7 LIMITED SOLUBILITY OF THIRD COMPONENT Author keyword 2 67% 0% 2
8 AU SN Author keyword 2 27% 2% 7
9 AU SN ALLOYS Author keyword 1 50% 0% 2
10 FACE DOWN BONDING CONFIGURATION Author keyword 1 100% 0% 2

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 FLUXLESS BONDING 12 53% 4% 16 Search FLUXLESS+BONDING Search FLUXLESS+BONDING
2 AU SN SOLDER 7 64% 2% 7 Search AU+SN+SOLDER Search AU+SN+SOLDER
3 FLUXLESS SOLDERING 3 29% 2% 10 Search FLUXLESS+SOLDERING Search FLUXLESS+SOLDERING
4 INTERDIFFUSION IN NANOSCALE SOLIDS 3 100% 1% 3 Search INTERDIFFUSION+IN+NANOSCALE+SOLIDS Search INTERDIFFUSION+IN+NANOSCALE+SOLIDS
5 FLUXLESS 2 24% 2% 8 Search FLUXLESS Search FLUXLESS
6 LIMITED SOLUBILITY OF THIRD COMPONENT 2 67% 0% 2 Search LIMITED+SOLUBILITY+OF+THIRD+COMPONENT Search LIMITED+SOLUBILITY+OF+THIRD+COMPONENT
7 AU SN 2 27% 2% 7 Search AU+SN Search AU+SN
8 AU SN ALLOYS 1 50% 0% 2 Search AU+SN+ALLOYS Search AU+SN+ALLOYS
9 FACE DOWN BONDING CONFIGURATION 1 100% 0% 2 Search FACE+DOWN+BONDING+CONFIGURATION Search FACE+DOWN+BONDING+CONFIGURATION
10 FLUX RESIDUES 1 50% 0% 2 Search FLUX+RESIDUES Search FLUX+RESIDUES

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 AU SN SOLDER 17 79% 3% 11
2 GOLD TIN FILMS 8 60% 2% 9
3 GOLD TIN 4 75% 1% 3
4 DIE ATTACHMENT 3 40% 1% 6
5 GOLD TIN ALLOYS 3 50% 1% 4
6 THIN FILM COUPLES 3 22% 3% 11
7 AUSN 2 67% 0% 2
8 METALLIZATION SCHEMES 2 67% 0% 2
9 AU CU SN 2 43% 1% 3
10 AU SN 2 43% 1% 3

Journals

Reviews


Title Publ. year Cit. Active
references		 % act. ref.
to same field
ADVANCED METALLIZATION SCHEMES FOR BONDING OF INP-BASED LASER DEVICES TO CVD-DIAMOND HEATSINKS 1994 26 9 56%
AU-SN ALLOY PHASE-DIAGRAM AND PROPERTIES RELATED TO ITS USE AS A BONDING MEDIUM 1993 88 35 66%
Room-temperature reactions in thin metal couples 1998 15 46 54%
Bonding techniques for hybrid active pixel sensors (HAPS) 2007 12 22 9%
PLATINUM TIN AND GOLD TIN BIMETALLIC PARTICLES PREPARED FROM SOLVATED METAL ATOMS - STRUCTURE AND CATALYSIS 1993 1 36 14%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ.
in class
1 MAT MFG TECHNOL PROGRAM 6 100% 1.0% 4
2 ELECT ENGN COMP SCI MAT MFG TECHNOL 1 40% 0.5% 2
3 MICRO NANOSYST TECHNOL 1 21% 0.7% 3
4 NEW E OCEAN 1 50% 0.2% 1
5 PKG TECHNOL TEAM 1 50% 0.2% 1
6 SIM DAIMLER BENZ 1 50% 0.2% 1
7 SIM DAIMLERCHRYSLER 1 29% 0.5% 2
8 ATZ 0 33% 0.2% 1
9 MAT ELECT ENGN IWE1 1 0 33% 0.2% 1
10 RELIABIL PHYS ITS PLICAT TECHNOL 0 33% 0.2% 1

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000264866 NANOSCALE SILVER PASTE//NANOSILVER PASTE//TIANJIN ADV JOINING TECHNOL
2 0.0000240566 HEAT TRANSFER INSTABILITY//INDIUM JOINT//INFRARED IR EMISSIONS
3 0.0000209152 HONG KONG BEIJING JOINT//MATEMATYKI FIZYKI//GEN LASER PHYS
4 0.0000203558 LEAD FREE SOLDER//PB FREE SOLDER//LEAD FREE SOLDERS
5 0.0000156015 INNER LEAD BONDING ILB//INNER LEAD BONDING//LASER SOLDERING
6 0.0000123894 UDIL//BRINDISI FUEL CELL DURABIL//LEVELLERS
7 0.0000096852 TIN ELECTRODEPOSITION//CONNECTING RELIABILITY//POLYETHER LAPROL
8 0.0000094946 WAFER BONDING//ANODIC BONDING//SILICON WAFER BONDING
9 0.0000074625 AUAL2//PTAL2//KONSTANTINOV PETERBURG NUCL PHYS
10 0.0000056787 KUDAMATSU PLANT//NICKEL TIN//THERMAL EQUILIBRIUM DIAGRAM