Class information for:
Level 1: MAKYOH TOPOGRAPHY//WIRE SAWING//WAFER PRODUCTION

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
19644 431 16.8 44%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
2776 2621 CHEMICAL MECHANICAL POLISHING//CHEMICAL MECHANICAL PLANARIZATION//CMP

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 MAKYOH TOPOGRAPHY Author keyword 11 65% 3% 11
2 WIRE SAWING Author keyword 5 37% 2% 10
3 WAFER PRODUCTION Author keyword 4 67% 1% 4
4 WIRESAW Author keyword 4 75% 1% 3
5 SEMICONDUCTOR MATERIAL Author keyword 3 20% 3% 14
6 WIRE SAW Author keyword 3 32% 2% 7
7 DIAMOND WIRE SAW Author keyword 3 28% 2% 8
8 MULTI WIRE SAWING Author keyword 2 44% 1% 4
9 CELL THINNING Author keyword 2 67% 0% 2
10 CHIP STRENGTH Author keyword 2 67% 0% 2

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 MAKYOH TOPOGRAPHY 11 65% 3% 11 Search MAKYOH+TOPOGRAPHY Search MAKYOH+TOPOGRAPHY
2 WIRE SAWING 5 37% 2% 10 Search WIRE+SAWING Search WIRE+SAWING
3 WAFER PRODUCTION 4 67% 1% 4 Search WAFER+PRODUCTION Search WAFER+PRODUCTION
4 WIRESAW 4 75% 1% 3 Search WIRESAW Search WIRESAW
5 SEMICONDUCTOR MATERIAL 3 20% 3% 14 Search SEMICONDUCTOR+MATERIAL Search SEMICONDUCTOR+MATERIAL
6 WIRE SAW 3 32% 2% 7 Search WIRE+SAW Search WIRE+SAW
7 DIAMOND WIRE SAW 3 28% 2% 8 Search DIAMOND+WIRE+SAW Search DIAMOND+WIRE+SAW
8 MULTI WIRE SAWING 2 44% 1% 4 Search MULTI+WIRE+SAWING Search MULTI+WIRE+SAWING
9 CELL THINNING 2 67% 0% 2 Search CELL+THINNING Search CELL+THINNING
10 CHIP STRENGTH 2 67% 0% 2 Search CHIP+STRENGTH Search CHIP+STRENGTH

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ.
in class
1 SILICON DIE 7 64% 2% 7
2 WIRESAW 6 71% 1% 5
3 CHUCK SHAPE 6 100% 1% 4
4 MAGIC MIRROR METHOD 3 57% 1% 4
5 LAPLACIAN IMAGE 3 100% 1% 3
6 CHIP STRENGTH 2 67% 0% 2
7 MAKYOH 2 50% 1% 3
8 DIE ATTACH TECHNIQUE 1 100% 0% 2
9 MACHINING FAM PROCESSES 1 100% 0% 2
10 ORIENTAL MAGIC MIRRORS 1 100% 0% 2

Journals

Reviews


Title Publ. year Cit. Active references % act. ref.
to same field
Grinding of silicon wafers: A review from historical perspectives 2008 31 28 93%
Basic mechanisms and models of multi-wire sawing 2004 64 23 48%
Simultaneous double side grinding of silicon wafers: a literature review 2006 11 7 100%
Machining processes for sapphire wafers: a literature review 2011 6 27 56%
Review of Microcrack Detection Techniques for Silicon Solar Cells 2014 1 33 27%
Die singulation technologies for advanced packaging: A critical review 2012 9 62 23%
Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review 2015 0 34 29%
Proteolytic dysfunction in neurodegenerative disorders 2004 13 126 1%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ.
in class
1 GEORGIA TECH MFG 1 50% 0.5% 2
2 LEADERS GLOBAL OPERAT 1 100% 0.5% 2
3 METROL SYST 1 100% 0.5% 2
4 ESTUDIOS INVEST TECN GIPUZKOA 1 19% 0.9% 4
5 SYNCHROTRONSTRAHLUNG 1 12% 1.4% 6
6 PACKAGE DEV ENGN 1 50% 0.2% 1
7 PRECIS ENGN STRATEG PROGRAMME 1 50% 0.2% 1
8 ASSEMBLY PACKAGING TECHNOL 0 33% 0.2% 1
9 ENSEIRBUMR 5218 0 33% 0.2% 1
10 MECH ENGNMINIST EDUC 0 33% 0.2% 1

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000162413 MONOCRYSTALLINE SILICON SURFACE//AU SI THIN FILMS//FOCUSSED ION BEAM MICROSCOPY
2 0.0000104433 GRINDING//VITRIFIED BOND//AMTREL
3 0.0000078178 DIAMOND TURNING//FAST TOOL SERVO//ROTARY ULTRASONIC MACHINING RUM
4 0.0000067901 PROVINCIAL KEY STONE MACHINING//INDUSTRIAL DIAMOND REVIEW//MARBLE TECHNOL
5 0.0000067493 METALLURGICAL GRADE SILICON//SOLAR GRADE SILICON//MULTICRYSTALLINE SILICON
6 0.0000060153 CHAIR PHYS CHEM 2//CRYSTAL REORIENTATION//NON PYROPHORIC
7 0.0000057773 STRIP BENDING TEST//MEMS PROD//HIGH CYCLE FATIGUE TEST
8 0.0000057027 CHEMICAL MECHANICAL POLISHING//CHEMICAL MECHANICAL PLANARIZATION//CMP
9 0.0000056265 HYDRODYNAMIC POLISHING PROCESS//ULTR RECIS SCI TECHNOL//JOINT OPTOMECHATRON DESIGN ENGN
10 0.0000054195 PROBE CARD//POROUS SILICON MICROMACHINING//VERTICAL ACTIVE DEVICES