Class information for:
Level 1: TIN ELECTRODEPOSITION//CONNECTING RELIABILITY//POLYETHER LAPROL

Basic class information

ID Publications Average number
of references
Avg. shr. active
ref. in WoS
17404 537 19.3 36%



Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)



ID, lev.
above
Publications Label for level above
504 14575 PLATING AND SURFACE FINISHING//ELECTRODEPOSITION//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Terms with highest relevance score



Rank Term Type of term Relevance score
(tfidf)
Class's shr.
of term's tot.
occurrences
Shr. of publ.
in class containing
term
Num. of
publ.
in class
1 TIN ELECTRODEPOSITION Author keyword 12 86% 1% 6
2 CONNECTING RELIABILITY Author keyword 6 100% 1% 4
3 POLYETHER LAPROL Author keyword 6 100% 1% 4
4 PERFLUORINATED CATIONIC SURFACTANT Author keyword 4 75% 1% 3
5 N N BISPOLYOXYETHYLENEOCTADECYLAMINE Author keyword 3 100% 1% 3
6 POLYETHER SINTANOL Author keyword 3 100% 1% 3
7 SN ZN DEPOSIT Author keyword 3 100% 1% 3
8 TIN COPPER ALLOYS Author keyword 3 100% 1% 3
9 NON CYANIDE BATH Author keyword 3 45% 1% 5
10 COPPER ZINC ALLOYS Author keyword 2 44% 1% 4

Web of Science journal categories

Author Key Words



Rank Web of Science journal category Relevance score
(tfidf)
Class's shr.
of term's tot.
occurrences
Shr. of publ.
in class containing
term
Num. of
publ.
in class
LCSH search Wikipedia search
1 TIN ELECTRODEPOSITION 12 86% 1% 6 Search TIN+ELECTRODEPOSITION Search TIN+ELECTRODEPOSITION
2 CONNECTING RELIABILITY 6 100% 1% 4 Search CONNECTING+RELIABILITY Search CONNECTING+RELIABILITY
3 POLYETHER LAPROL 6 100% 1% 4 Search POLYETHER+LAPROL Search POLYETHER+LAPROL
4 PERFLUORINATED CATIONIC SURFACTANT 4 75% 1% 3 Search PERFLUORINATED+CATIONIC+SURFACTANT Search PERFLUORINATED+CATIONIC+SURFACTANT
5 N N BISPOLYOXYETHYLENEOCTADECYLAMINE 3 100% 1% 3 Search N+N+BISPOLYOXYETHYLENEOCTADECYLAMINE Search N+N+BISPOLYOXYETHYLENEOCTADECYLAMINE
6 POLYETHER SINTANOL 3 100% 1% 3 Search POLYETHER+SINTANOL Search POLYETHER+SINTANOL
7 SN ZN DEPOSIT 3 100% 1% 3 Search SN+ZN+DEPOSIT Search SN+ZN+DEPOSIT
8 TIN COPPER ALLOYS 3 100% 1% 3 Search TIN+COPPER+ALLOYS Search TIN+COPPER+ALLOYS
9 NON CYANIDE BATH 3 45% 1% 5 Search NON+CYANIDE+BATH Search NON+CYANIDE+BATH
10 COPPER ZINC ALLOYS 2 44% 1% 4 Search COPPER+ZINC+ALLOYS Search COPPER+ZINC+ALLOYS

Key Words Plus



Rank Web of Science journal category Relevance score
(tfidf)
Class's shr.
of term's tot.
occurrences
Shr. of publ.
in class containing
term
Num. of
publ. in
class
1 LAPROL 2402 C 30 100% 2% 12
2 PERFLUORINATED CATIONIC SURFACTANT 19 80% 2% 12
3 STANNOUS SULFATE SOLUTIONS 14 100% 1% 7
4 CU CUII 12 86% 1% 6
5 SULFONATE BATH 12 86% 1% 6
6 ELECTRODEPOSITED TIN 10 73% 1% 8
7 TIN COPPER ALLOYS 9 83% 1% 5
8 TINII ION 9 83% 1% 5
9 CATHODIC PROCESSES 4 75% 1% 3
10 TIN ZINC ELECTRODEPOSITION 4 75% 1% 3

Journals

Reviews



Title Publ. year Cit. Active
references
% act. ref.
to same field
Electrodeposition of lead-free solder alloys 2013 0 59 76%
The effect of sorbitol on the morphological characteristics of lead-tin films electrodeposited from an alkaline bath 2007 0 15 40%
HYDROLYSIS OF TIN(II) IN AQUEOUS-SOLUTIONS 1981 20 1 100%

Address terms



Rank Address term Relevance score
(tfidf)
Class's shr.
of term's tot.
occurrences
Shr. of publ.
in class containing
term
Num. of
publ.
in class
1 THIO FINE CHEM 2 43% 0.6% 3
2 CEMOPUNINOVA 1 50% 0.2% 1
3 GRP MICRO NANO ENGN 1 50% 0.2% 1
4 IUT DORSAY 1 50% 0.2% 1
5 PAINTS COATINGS DEV 1 50% 0.2% 1
6 SAE TECHNOL 1 50% 0.2% 1
7 ELECT PACKAGING GRP 1 25% 0.4% 2
8 KILIS VOCAT HIGH 0 20% 0.4% 2
9 ASCR VVI 0 33% 0.2% 1
10 CHAIRE MAT IND MET CERAM 0 25% 0.2% 1

Related classes at same level (level 1)



Rank Relatedness score Related classes
1 0.0000273263 KUDAMATSU PLANT//NICKEL TIN//THERMAL EQUILIBRIUM DIAGRAM
2 0.0000165923 TIN WHISKER//TIN WHISKERS//SN WHISKER
3 0.0000164130 ZN CO ALLOY//ZINC NICKEL ALLOYS//ZN NI ALLOY
4 0.0000129631 AFDELING COORDINATIECHEM//ALKALINE NON CYANIDE//INDUSTRIAL ELECTRO REFINING ELECTROLYTES
5 0.0000109325 SILVER INDIUM ALLOY//SILVER BISMUTH ALLOYS//ROSTISLAV KAI EW PHYS CHEM
6 0.0000106928 SELF ANNEALING//COPPER ELECTRODEPOSITION//COPPER ELECTROPLATING
7 0.0000101456 TINPLATE//MAT PROC TERMOMECAN//ESCUELA MECAN
8 0.0000096852 FLUXLESS BONDING//AU SN SOLDER//MAT MFG TECHNOL PROGRAM
9 0.0000084872 DEEP EUTECTIC SOLVENT//DEEP EUTECTIC SOLVENTS//CHOLINE CHLORIDE
10 0.0000081759 COFE FILMS//PRECIS ELECT TECHNOL//FECONI ALLOY