Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
17404 | 537 | 19.3 | 36% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
504 | 14575 | PLATING AND SURFACE FINISHING//ELECTRODEPOSITION//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | TIN ELECTRODEPOSITION | Author keyword | 12 | 86% | 1% | 6 |
2 | CONNECTING RELIABILITY | Author keyword | 6 | 100% | 1% | 4 |
3 | POLYETHER LAPROL | Author keyword | 6 | 100% | 1% | 4 |
4 | PERFLUORINATED CATIONIC SURFACTANT | Author keyword | 4 | 75% | 1% | 3 |
5 | N N BISPOLYOXYETHYLENEOCTADECYLAMINE | Author keyword | 3 | 100% | 1% | 3 |
6 | POLYETHER SINTANOL | Author keyword | 3 | 100% | 1% | 3 |
7 | SN ZN DEPOSIT | Author keyword | 3 | 100% | 1% | 3 |
8 | TIN COPPER ALLOYS | Author keyword | 3 | 100% | 1% | 3 |
9 | NON CYANIDE BATH | Author keyword | 3 | 45% | 1% | 5 |
10 | COPPER ZINC ALLOYS | Author keyword | 2 | 44% | 1% | 4 |
Web of Science journal categories |
Author Key Words |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | TIN ELECTRODEPOSITION | 12 | 86% | 1% | 6 | Search TIN+ELECTRODEPOSITION | Search TIN+ELECTRODEPOSITION |
2 | CONNECTING RELIABILITY | 6 | 100% | 1% | 4 | Search CONNECTING+RELIABILITY | Search CONNECTING+RELIABILITY |
3 | POLYETHER LAPROL | 6 | 100% | 1% | 4 | Search POLYETHER+LAPROL | Search POLYETHER+LAPROL |
4 | PERFLUORINATED CATIONIC SURFACTANT | 4 | 75% | 1% | 3 | Search PERFLUORINATED+CATIONIC+SURFACTANT | Search PERFLUORINATED+CATIONIC+SURFACTANT |
5 | N N BISPOLYOXYETHYLENEOCTADECYLAMINE | 3 | 100% | 1% | 3 | Search N+N+BISPOLYOXYETHYLENEOCTADECYLAMINE | Search N+N+BISPOLYOXYETHYLENEOCTADECYLAMINE |
6 | POLYETHER SINTANOL | 3 | 100% | 1% | 3 | Search POLYETHER+SINTANOL | Search POLYETHER+SINTANOL |
7 | SN ZN DEPOSIT | 3 | 100% | 1% | 3 | Search SN+ZN+DEPOSIT | Search SN+ZN+DEPOSIT |
8 | TIN COPPER ALLOYS | 3 | 100% | 1% | 3 | Search TIN+COPPER+ALLOYS | Search TIN+COPPER+ALLOYS |
9 | NON CYANIDE BATH | 3 | 45% | 1% | 5 | Search NON+CYANIDE+BATH | Search NON+CYANIDE+BATH |
10 | COPPER ZINC ALLOYS | 2 | 44% | 1% | 4 | Search COPPER+ZINC+ALLOYS | Search COPPER+ZINC+ALLOYS |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | LAPROL 2402 C | 30 | 100% | 2% | 12 |
2 | PERFLUORINATED CATIONIC SURFACTANT | 19 | 80% | 2% | 12 |
3 | STANNOUS SULFATE SOLUTIONS | 14 | 100% | 1% | 7 |
4 | CU CUII | 12 | 86% | 1% | 6 |
5 | SULFONATE BATH | 12 | 86% | 1% | 6 |
6 | ELECTRODEPOSITED TIN | 10 | 73% | 1% | 8 |
7 | TIN COPPER ALLOYS | 9 | 83% | 1% | 5 |
8 | TINII ION | 9 | 83% | 1% | 5 |
9 | CATHODIC PROCESSES | 4 | 75% | 1% | 3 |
10 | TIN ZINC ELECTRODEPOSITION | 4 | 75% | 1% | 3 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
---|---|---|---|---|
Electrodeposition of lead-free solder alloys | 2013 | 0 | 59 | 76% |
The effect of sorbitol on the morphological characteristics of lead-tin films electrodeposited from an alkaline bath | 2007 | 0 | 15 | 40% |
HYDROLYSIS OF TIN(II) IN AQUEOUS-SOLUTIONS | 1981 | 20 | 1 | 100% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | THIO FINE CHEM | 2 | 43% | 0.6% | 3 |
2 | CEMOPUNINOVA | 1 | 50% | 0.2% | 1 |
3 | GRP MICRO NANO ENGN | 1 | 50% | 0.2% | 1 |
4 | IUT DORSAY | 1 | 50% | 0.2% | 1 |
5 | PAINTS COATINGS DEV | 1 | 50% | 0.2% | 1 |
6 | SAE TECHNOL | 1 | 50% | 0.2% | 1 |
7 | ELECT PACKAGING GRP | 1 | 25% | 0.4% | 2 |
8 | KILIS VOCAT HIGH | 0 | 20% | 0.4% | 2 |
9 | ASCR VVI | 0 | 33% | 0.2% | 1 |
10 | CHAIRE MAT IND MET CERAM | 0 | 25% | 0.2% | 1 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000273263 | KUDAMATSU PLANT//NICKEL TIN//THERMAL EQUILIBRIUM DIAGRAM |
2 | 0.0000165923 | TIN WHISKER//TIN WHISKERS//SN WHISKER |
3 | 0.0000164130 | ZN CO ALLOY//ZINC NICKEL ALLOYS//ZN NI ALLOY |
4 | 0.0000129631 | AFDELING COORDINATIECHEM//ALKALINE NON CYANIDE//INDUSTRIAL ELECTRO REFINING ELECTROLYTES |
5 | 0.0000109325 | SILVER INDIUM ALLOY//SILVER BISMUTH ALLOYS//ROSTISLAV KAI EW PHYS CHEM |
6 | 0.0000106928 | SELF ANNEALING//COPPER ELECTRODEPOSITION//COPPER ELECTROPLATING |
7 | 0.0000101456 | TINPLATE//MAT PROC TERMOMECAN//ESCUELA MECAN |
8 | 0.0000096852 | FLUXLESS BONDING//AU SN SOLDER//MAT MFG TECHNOL PROGRAM |
9 | 0.0000084872 | DEEP EUTECTIC SOLVENT//DEEP EUTECTIC SOLVENTS//CHOLINE CHLORIDE |
10 | 0.0000081759 | COFE FILMS//PRECIS ELECT TECHNOL//FECONI ALLOY |