Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
16686 | 576 | 18.1 | 80% |
Classes in level above (level 2) |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | SOCIOTECHNO SCI TECHNOL | Address | 26 | 87% | 2% | 13 |
2 | N GAN | Author keyword | 2 | 28% | 1% | 7 |
3 | GALLIUM HYDROXIDE | Author keyword | 2 | 67% | 0% | 2 |
4 | MAT STUDY TESTING | Address | 2 | 16% | 2% | 12 |
5 | NAT MAT STUDY TESTING | Address | 1 | 100% | 0% | 2 |
6 | REACTIVE ION PLASMA | Author keyword | 1 | 50% | 0% | 2 |
7 | SEMICOND TECHNOL SCI | Address | 1 | 100% | 0% | 2 |
8 | SOCIO TECHNO SCI TECHNOL | Address | 1 | 100% | 0% | 2 |
9 | ELECT ENGN NANOTECHNOL | Address | 1 | 13% | 1% | 8 |
10 | PHOTOELECTROCHEMICAL ETCHING | Author keyword | 1 | 16% | 1% | 6 |
Web of Science journal categories |
Author Key Words |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | N GAN | 2 | 28% | 1% | 7 | Search N+GAN | Search N+GAN |
2 | GALLIUM HYDROXIDE | 2 | 67% | 0% | 2 | Search GALLIUM+HYDROXIDE | Search GALLIUM+HYDROXIDE |
3 | REACTIVE ION PLASMA | 1 | 50% | 0% | 2 | Search REACTIVE+ION+PLASMA | Search REACTIVE+ION+PLASMA |
4 | PHOTOELECTROCHEMICAL ETCHING | 1 | 16% | 1% | 6 | Search PHOTOELECTROCHEMICAL+ETCHING | Search PHOTOELECTROCHEMICAL+ETCHING |
5 | TIME OF FLIGHT DISTRIBUTION | 1 | 40% | 0% | 2 | Search TIME+OF+FLIGHT+DISTRIBUTION | Search TIME+OF+FLIGHT+DISTRIBUTION |
6 | REACTIVE ION BEAM ETCHING RIBE | 1 | 33% | 0% | 2 | Search REACTIVE+ION+BEAM+ETCHING+RIBE | Search REACTIVE+ION+BEAM+ETCHING+RIBE |
7 | ICP ETCHING | 1 | 12% | 1% | 6 | Search ICP+ETCHING | Search ICP+ETCHING |
8 | BLACK LIGHT IRRADIATION | 1 | 50% | 0% | 1 | Search BLACK+LIGHT+IRRADIATION | Search BLACK+LIGHT+IRRADIATION |
9 | CL 2 AR BCL3 | 1 | 50% | 0% | 1 | Search CL+2+AR+BCL3 | Search CL+2+AR+BCL3 |
10 | CL 2 BCL3 | 1 | 50% | 0% | 1 | Search CL+2+BCL3 | Search CL+2+BCL3 |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | CL 2 AR | 14 | 53% | 3% | 18 |
2 | CL 2 BCL3 PLASMAS | 9 | 83% | 1% | 5 |
3 | DRY ETCH DAMAGE | 8 | 39% | 3% | 16 |
4 | BCL3 | 7 | 28% | 4% | 21 |
5 | SURFACE CHARGE LITHOGRAPHY | 3 | 57% | 1% | 4 |
6 | GAN ETCHING DAMAGE | 3 | 100% | 1% | 3 |
7 | MAGNESIUM DIFFUSION | 3 | 50% | 1% | 4 |
8 | BCL3 BASED PLASMAS | 2 | 67% | 0% | 2 |
9 | N 2 PLASMA | 2 | 40% | 1% | 4 |
10 | ETCHING DAMAGE | 2 | 29% | 1% | 5 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references | % act. ref. to same field |
---|---|---|---|---|
Wet etching of GaN, AIN, and SiC: a review | 2005 | 267 | 161 | 24% |
A review of dry etching of GaN and related materials | 2000 | 35 | 6 | 67% |
The dry etching of group III nitride wide-bandgap semiconductors | 1996 | 32 | 42 | 50% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | SOCIOTECHNO SCI TECHNOL | 26 | 87% | 2.3% | 13 |
2 | MAT STUDY TESTING | 2 | 16% | 2.1% | 12 |
3 | NAT MAT STUDY TESTING | 1 | 100% | 0.3% | 2 |
4 | SEMICOND TECHNOL SCI | 1 | 100% | 0.3% | 2 |
5 | SOCIO TECHNO SCI TECHNOL | 1 | 100% | 0.3% | 2 |
6 | ELECT ENGN NANOTECHNOL | 1 | 13% | 1.4% | 8 |
7 | ADV DEVICES GRP | 1 | 40% | 0.3% | 2 |
8 | COBRA INTERUNIV COMMUN TECHNOL | 1 | 27% | 0.5% | 3 |
9 | PHOTON SEMICOND | 1 | 27% | 0.5% | 3 |
10 | JST UCSB GRP | 1 | 33% | 0.3% | 2 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000242929 | P INGAN//GAN SIC HETEROJUNCTION//COMMON EMITTER |
2 | 0.0000231942 | ELECTROLYTIC COPPER ADDITION//BCL3 PLASMA//FIS CHIM SUPERFICI INTER E |
3 | 0.0000184553 | P GAN//OHMIC CONTACT//OHMIC CONTACTS |
4 | 0.0000179290 | FUJIMI KU//GAAS OXIDE//REACTIVE ION BEAM ETCHING |
5 | 0.0000175187 | HIGH RESOLUTION X RAY MICROSCOPY//INNER SHELL ELECTRON EXCITATION//INTENSE X RAYS |
6 | 0.0000173752 | LIGHT EXTRACTION EFFICIENCY//LIGHT EMITTING DIODE LED//PATTERNED SAPPHIRE SUBSTRATE PSS |
7 | 0.0000163934 | OBNINSK BRANCH FED STATE UNITARY ENTERPRISE//YELLOW LUMINESCENCE//MRS INTERNET JOURNAL OF NITRIDE SEMICONDUCTOR RESEARCH |
8 | 0.0000124360 | GAN//HYDRIDE VAPOR PHASE EPITAXY//AMMONOTHERMAL CRYSTAL GROWTH |
9 | 0.0000122111 | TORAT PROSTHET DENT SECT//NCSU UNC CH JOINT BIOMED ENGN//IMMUNOFET |
10 | 0.0000108210 | POROUS INP//LOW DIMENS SEMICOND STRUCT//POROUS SIC |