Class information for:
Level 1: UNDERFILL FLOW//WIRE SWEEP//BUMP PITCH

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
15861 619 17.2 43%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
688 12395 LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 UNDERFILL FLOW Author keyword 17 79% 2% 11
2 WIRE SWEEP Author keyword 15 68% 2% 13
3 BUMP PITCH Author keyword 15 88% 1% 7
4 POPCORN CRACKING Author keyword 9 83% 1% 5
5 CASTRO MACOSKO MODEL Author keyword 8 100% 1% 5
6 ENCAPSULANT RESIN Author keyword 6 100% 1% 4
7 PLASTIC IC PACKAGE Author keyword 6 100% 1% 4
8 TEMPERATURE CYCLIC LOADING Author keyword 4 67% 1% 4
9 PADDLE SHIFT Author keyword 4 75% 0% 3
10 PASSIVATION CRACKS Author keyword 4 75% 0% 3

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 UNDERFILL FLOW 17 79% 2% 11 Search UNDERFILL+FLOW Search UNDERFILL+FLOW
2 WIRE SWEEP 15 68% 2% 13 Search WIRE+SWEEP Search WIRE+SWEEP
3 BUMP PITCH 15 88% 1% 7 Search BUMP+PITCH Search BUMP+PITCH
4 POPCORN CRACKING 9 83% 1% 5 Search POPCORN+CRACKING Search POPCORN+CRACKING
5 CASTRO MACOSKO MODEL 8 100% 1% 5 Search CASTRO+MACOSKO+MODEL Search CASTRO+MACOSKO+MODEL
6 ENCAPSULANT RESIN 6 100% 1% 4 Search ENCAPSULANT+RESIN Search ENCAPSULANT+RESIN
7 PLASTIC IC PACKAGE 6 100% 1% 4 Search PLASTIC+IC+PACKAGE Search PLASTIC+IC+PACKAGE
8 TEMPERATURE CYCLIC LOADING 4 67% 1% 4 Search TEMPERATURE+CYCLIC+LOADING Search TEMPERATURE+CYCLIC+LOADING
9 PADDLE SHIFT 4 75% 0% 3 Search PADDLE+SHIFT Search PADDLE+SHIFT
10 PASSIVATION CRACKS 4 75% 0% 3 Search PASSIVATION+CRACKS Search PASSIVATION+CRACKS

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 3 DIMENSIONAL PADDLE SHIFT 14 100% 1% 7
2 ENCAPSULATION PROCESS 13 80% 1% 8
3 MOLD COMPOUNDS 11 100% 1% 6
4 WIRE SWEEP 11 78% 1% 7
5 SOLDER BUMP 10 52% 2% 14
6 PLASTIC IC PACKAGES 6 36% 2% 13
7 IC PACKAGES 5 31% 2% 13
8 NUMERICAL STRESS ANALYSIS 4 75% 0% 3
9 MOLDING COMPOUND 3 23% 2% 10
10 UNDERFILL 2 16% 2% 14

Journals

Reviews


Title Publ. year Cit. Active
references		 % act. ref.
to same field
The reproductive tract 2004 4 1 100%
Recent fluid-structure interaction modeling challenges in IC encapsulation - A review 2014 0 58 78%
STRUCTURAL DESIGN OF PLASTIC IC-PACKAGES 1989 1 5 60%
Green chemistry in the microelectronics industry 2004 22 49 6%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ.
in class
1 PACKAGING DEV TEAM 2 67% 0.3% 2
2 ATO INNOVAT 2 50% 0.5% 3
3 CORP ASSEMBLY TEST 1 50% 0.3% 2
4 ELECT DEVICE MAT 1 50% 0.3% 2
5 MAT EQUIPMENT ENGN 1 100% 0.3% 2
6 MOTOROLA COMMUN SECTOR 1 100% 0.3% 2
7 WORLDWIDE MFG GRP 1 50% 0.3% 2
8 MECH RELIABIL MICRO MAT 1 33% 0.5% 3
9 OPTOELECT PACKAGING INTEGRAT 1 40% 0.3% 2
10 ADV ELECT MFG 1 33% 0.3% 2

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000168572 PLASTIC ENCAPSULATED MICROCIRCUIT//NONHERMETIC//DORMANT STORAGE
2 0.0000140614 JOURNAL OF ELECTRONIC PACKAGING//SOLDERING & SURFACE MOUNT TECHNOLOGY//SOLDER JOINT
3 0.0000131062 WIRE BONDING//ULTRASONIC WEDGE BONDING//MICROJOINING
4 0.0000108861 ANISOTROPIC CONDUCTIVE ADHESIVE ACA//ANISOTROPIC CONDUCTIVE FILM ACF//ANISOTROPIC CONDUCTIVE FILM
5 0.0000096350 TIME PRESSURE DISPENSING//JETTING DISPENSER//DISPENSING PROCESS
6 0.0000087906 INTERFACE CRACK//CHANNELING CRACK//CHANNEL CRACKING
7 0.0000079241 INNER LEAD BONDING ILB//INNER LEAD BONDING//LASER SOLDERING
8 0.0000073715 SPRING IN//TOOL PART INTERACTION//RESIDUAL INTERNAL STRESS
9 0.0000064025 HYGROTHERMAL AGING//TRANSIENT HYGROSCOPIC STRESSES//HYGROTHERMAL EFFECT
10 0.0000063146 HEAT TRANSFER INSTABILITY//INDIUM JOINT//INFRARED IR EMISSIONS