Class information for:
Level 1: ELECT DEVICES MAT TECHNOL//SIO2 ETCHING//PLASMA ETCHING

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
1489 2541 23.6 70%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
1317 8022 ELECT DEVICES MAT TECHNOL//PLASMA ETCHING//SIO2 ETCHING

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 ELECT DEVICES MAT TECHNOL Address 140 94% 2% 49
2 SIO2 ETCHING Author keyword 33 67% 1% 29
3 PLASMA ETCHING Author keyword 19 15% 5% 115
4 CF2 RADICAL Author keyword 18 89% 0% 8
5 RIE LAG Author keyword 18 55% 1% 22
6 CF2 Author keyword 17 68% 1% 15
7 ETCH MECHANISM Author keyword 17 72% 1% 13
8 IRLAS Author keyword 17 100% 0% 8
9 ULTRAHIGH FREQUENCY PLASMA Author keyword 17 100% 0% 8
10 ELECTRON SHADING Author keyword 15 82% 0% 9

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 SIO2 ETCHING 33 67% 1% 29 Search SIO2+ETCHING Search SIO2+ETCHING
2 PLASMA ETCHING 19 15% 5% 115 Search PLASMA+ETCHING Search PLASMA+ETCHING
3 CF2 RADICAL 18 89% 0% 8 Search CF2+RADICAL Search CF2+RADICAL
4 RIE LAG 18 55% 1% 22 Search RIE+LAG Search RIE+LAG
5 CF2 17 68% 1% 15 Search CF2 Search CF2
6 ETCH MECHANISM 17 72% 1% 13 Search ETCH+MECHANISM Search ETCH+MECHANISM
7 IRLAS 17 100% 0% 8 Search IRLAS Search IRLAS
8 ULTRAHIGH FREQUENCY PLASMA 17 100% 0% 8 Search ULTRAHIGH+FREQUENCY+PLASMA Search ULTRAHIGH+FREQUENCY+PLASMA
9 ELECTRON SHADING 15 82% 0% 9 Search ELECTRON+SHADING Search ELECTRON+SHADING
10 MICROSCOPIC UNIFORMITY 14 100% 0% 7 Search MICROSCOPIC+UNIFORMITY Search MICROSCOPIC+UNIFORMITY

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 HIGH DENSITY PLASMAS 160 66% 6% 150
2 FLUOROCARBON PLASMAS 75 58% 3% 86
3 HBR CL 2 O 2 73 96% 1% 23
4 CHAMBER WALLS 65 90% 1% 28
5 CYCLOTRON RESONANCE PLASMA 56 28% 7% 167
6 RADICAL DENSITIES 56 85% 1% 29
7 SIDEWALL PASSIVATION 51 91% 1% 21
8 CL 2 AR PLASMAS 48 91% 1% 20
9 SURFACE KINETICS 47 62% 2% 49
10 CHF3 45 42% 3% 84

Journals

Reviews


Title Publ. year Cit. Active references % act. ref.
to same field
High aspect ratio silicon etch: A review 2010 123 77 70%
Plasma cryogenic etching of silicon: from the early days to today's advanced technologies 2014 15 97 67%
Plasma etching: Yesterday, today, and tomorrow 2013 53 262 43%
Pulsed high-density plasmas for advanced dry etching processes 2012 35 105 79%
Black silicon method X: a review on high speed and selective plasma etching of silicon with profile control: an in-depth comparison between Bosch and cryostat DRIE processes as a roadmap to next generation equipment 2009 71 227 52%
Developments of plasma etching technology for fabricating semiconductor devices 2008 96 86 40%
Pulsed plasma etching for semiconductor manufacturing 2014 7 116 46%
Critical review: Plasma-surface reactions and the spinning wall method 2011 13 81 74%
Review of profile and roughening simulation in microelectronics plasma etching 2009 25 100 56%
SELECTIVE REMOVAL OF HIGH-K GATE DIELECTRICS 2009 23 87 49%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 ELECT DEVICES MAT TECHNOL 140 94% 1.9% 49
2 TECHNOL MICROELECT 13 25% 1.7% 43
3 LSI BASIC 11 69% 0.4% 9
4 MAT MACHINERY GRP 8 100% 0.2% 5
5 ENVIRONM BENIGN ETCHING TECHNOL 6 80% 0.2% 4
6 PLASMA SUR E INTERACT 6 58% 0.3% 7
7 SI SYST S 6 100% 0.2% 4
8 MICROELECT DEVICES MAT TECHNOL 4 39% 0.4% 9
9 DRAM MFG 4 75% 0.1% 3
10 IMN PLASMAS COUCHES MINCES 4 75% 0.1% 3

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000261428 CHEMICAL DRY ETCHING//PLASMA NANOTECHNOL PLANT//AFTER CORROSION
2 0.0000208291 ATOMIC LAYER ETCHING//GATE CHARGING//NEUTRAL BEAM ETCHING
3 0.0000186170 ELECTROLYTIC COPPER ADDITION//BCL3 PLASMA//FIS CHIM SUPERFICI INTER E
4 0.0000156735 MEMS PATTERNING//ETCHING DAMAGE//RUOX PT
5 0.0000155247 LOW INDUCTANCE ANTENNA//LOW DAMAGE PROCESS//INDUCTIVELY COUPLED PLASMA
6 0.0000142147 LADDER SHAPED ELECTRODE//PLASMA ATOM PHYS//VHF PLASMA
7 0.0000107767 VACUUM TECHNOL//ACTIVE PLASMA RESONANCE SPECTROSCOPY//CUTOFF PROBE
8 0.0000104583 MAGNETIC NEUTRAL LINE//NEUTRAL LOOP DISCHARGE//TCO LESS DSCS
9 0.0000101846 INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING//TI HARD MASK//CL 2 BASED PLASMA
10 0.0000099411 FLUOROCARBON FILMS//FLUORINATED AMORPHOUS CARBON//A C F