Class information for:
Level 1: WIRE BONDING//ULTRASONIC WEDGE BONDING//MICROJOINING

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
13090 797 17.7 42%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
3026 2032 ULTRASONIC WELDING//WIRE BONDING//ULTRASONIC CONSOLIDATION

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 WIRE BONDING Author keyword 40 34% 12% 96
2 ULTRASONIC WEDGE BONDING Author keyword 24 91% 1% 10
3 MICROJOINING Address 15 40% 4% 29
4 THERMOSONIC WIRE BONDING Author keyword 15 63% 2% 15
5 COPPER WIRE BONDING Author keyword 15 77% 1% 10
6 THERMOSONIC BONDING Author keyword 14 65% 2% 13
7 AG 8AU 3PD ALLOY WIRE Author keyword 12 86% 1% 6
8 ULTRASONIC BONDING Author keyword 10 42% 2% 18
9 ULTRASONIC WIRE BONDING Author keyword 9 55% 2% 12
10 WIRE BONDABILITY Author keyword 9 83% 1% 5

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 WIRE BONDING 40 34% 12% 96 Search WIRE+BONDING Search WIRE+BONDING
2 ULTRASONIC WEDGE BONDING 24 91% 1% 10 Search ULTRASONIC+WEDGE+BONDING Search ULTRASONIC+WEDGE+BONDING
3 THERMOSONIC WIRE BONDING 15 63% 2% 15 Search THERMOSONIC+WIRE+BONDING Search THERMOSONIC+WIRE+BONDING
4 COPPER WIRE BONDING 15 77% 1% 10 Search COPPER+WIRE+BONDING Search COPPER+WIRE+BONDING
5 THERMOSONIC BONDING 14 65% 2% 13 Search THERMOSONIC+BONDING Search THERMOSONIC+BONDING
6 AG 8AU 3PD ALLOY WIRE 12 86% 1% 6 Search AG+8AU+3PD+ALLOY+WIRE Search AG+8AU+3PD+ALLOY+WIRE
7 ULTRASONIC BONDING 10 42% 2% 18 Search ULTRASONIC+BONDING Search ULTRASONIC+BONDING
8 ULTRASONIC WIRE BONDING 9 55% 2% 12 Search ULTRASONIC+WIRE+BONDING Search ULTRASONIC+WIRE+BONDING
9 WIRE BONDABILITY 9 83% 1% 5 Search WIRE+BONDABILITY Search WIRE+BONDABILITY
10 THERMOSONIC 8 50% 1% 11 Search THERMOSONIC Search THERMOSONIC

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 BALL BONDS 47 88% 3% 22
2 COPPER WIRE 30 57% 4% 35
3 LINKAGE SPRING MODEL 26 100% 1% 11
4 GOLD WIRE 23 79% 2% 15
5 BONDABILITY 18 59% 3% 20
6 INSULATED WIRE 17 100% 1% 8
7 MOBILE INTERFACE 12 86% 1% 6
8 ALUMINUM METALLIZATION PADS 11 100% 1% 6
9 AU4AL 6 58% 1% 7
10 WIRE BONDS 5 37% 1% 10

Journals

Reviews


Title Publ. year Cit. Active
references		 % act. ref.
to same field
Challenges and developments of copper wire bonding technology 2012 13 26 96%
A brief review of selected aspects of the materials science of ball bonding 2010 40 95 68%
Copper Wire Bonding Concerns and Best Practices 2013 9 38 92%
Some thoughts on bondability and strength of gold wire bonding 2012 6 23 100%
Future and technical considerations of gold wirebonding in semiconductor packaging - a technical review 2014 1 35 100%
Wire bonding quality monitoring via refining process of electrical signal from ultrasonic generator 2011 7 5 100%
Unconventional applications of wire bonding create opportunities for microsystem integration 2013 5 52 46%
Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years 2015 0 50 98%
Investigation of defect formation in porous ultra low k film (k=2.5) for 28 nm technological node 2015 0 4 75%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 MICROJOINING 15 40% 3.6% 29
2 ADV MAT JOINING 9 26% 3.6% 29
3 NANOELECT ENGN INEE 4 75% 0.4% 3
4 MAT PLICAT 2 23% 1.1% 9
5 CONTACT MAT 2 67% 0.3% 2
6 PACKAGING EQUIPMENT 2 67% 0.3% 2
7 MICROELECT NANO ENGN 2 50% 0.4% 3
8 CENT CHARACTERISAT 1 100% 0.3% 2
9 GLOBAL PACKAGING ENGN 1 100% 0.3% 2
10 PACKAGING RND ADV MFG ENGN 1 100% 0.3% 2

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000174701 ULTRASONIC CONSOLIDATION//ULTRASONIC WELDING//ULTRASONIC SPOT WELDING
2 0.0000153353 ULTRASONIC PLASTIC WELDING//HIGH FREQUENCY ULTRASONIC PLASTIC WELDING//FREQUENCY CHARACTERISTICS OF PLASTIC WELDING
3 0.0000131062 UNDERFILL FLOW//WIRE SWEEP//BUMP PITCH
4 0.0000080199 BAYESIAN SEQUENTIAL TEST//INGENIOUS MICROMFG SYST GRP//PROJECTION PURSUIT TYPE STATISTIC
5 0.0000071559 ANISOTROPIC CONDUCTIVE ADHESIVE ACA//ANISOTROPIC CONDUCTIVE FILM ACF//ANISOTROPIC CONDUCTIVE FILM
6 0.0000064121 PROBE CARD//POROUS SILICON MICROMACHINING//VERTICAL ACTIVE DEVICES
7 0.0000059382 AL PT//AMORPHOUS AL2PT//SELF ORGANISED STRUCTURE FORMATION
8 0.0000055127 THROUGH SILICON VIA TSV//3 D INTEGRATION//KEEP OUT ZONE KOZ
9 0.0000053609 LEADING EDGE TECHNOL DEV HEADQUARTERS//MAT IMF III//AL GE
10 0.0000052482 FLUXLESS BONDING//AU SN SOLDER//MAT MFG TECHNOL PROGRAM