Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
11976 | 876 | 20.5 | 35% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
1993 | 5054 | NANOELECT GIGASCALE SYST//ELECTROSTATIC DISCHARGE ESD//SILICON CONTROLLED RECTIFIER SCR |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | THERMAL PLACEMENT | Author keyword | 9 | 83% | 1% | 5 |
2 | DYNAMIC THERMAL MANAGEMENT DTM | Author keyword | 7 | 56% | 1% | 9 |
3 | TIME CONSTANT SPECTRUM | Author keyword | 6 | 80% | 0% | 4 |
4 | COMPACT THERMAL MODEL | Author keyword | 6 | 41% | 1% | 11 |
5 | MICROELECT COMP SCI | Address | 5 | 24% | 2% | 19 |
6 | COMPACT THERMAL MODELS | Author keyword | 5 | 44% | 1% | 8 |
7 | ELE ON DEVICES | Address | 4 | 18% | 2% | 21 |
8 | DYNAMIC THERMAL MANAGEMENT | Author keyword | 4 | 27% | 1% | 13 |
9 | TEMPERATURE DEPENDENT LEAKAGE POWER | Author keyword | 3 | 100% | 0% | 3 |
10 | THERMAL IMPEDANCE | Author keyword | 3 | 17% | 2% | 18 |
Web of Science journal categories |
Author Key Words |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | INFINITE PLATE STRUCTURES | 9 | 83% | 1% | 5 |
2 | FLUX CHANNELS | 9 | 52% | 1% | 12 |
3 | TRANSIENT TRAIT METHOD | 6 | 58% | 1% | 7 |
4 | ELECTROTHERMAL SIMULATION | 5 | 25% | 2% | 16 |
5 | ELECTROTHERMAL ANALYSIS | 4 | 50% | 1% | 6 |
6 | ELECTROTHERMAL DEVICE | 4 | 75% | 0% | 3 |
7 | MULTIOBJECTIVE OPTIMAL PLACEMENT | 4 | 75% | 0% | 3 |
8 | RATIONAL FORMULATION | 4 | 40% | 1% | 8 |
9 | HEAT FLOW PATH | 3 | 38% | 1% | 6 |
10 | THERMAL SPREADING RESISTANCE | 3 | 60% | 0% | 3 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
---|---|---|---|---|
Dynamic electro-thermal simulation of microsystems - a review | 2005 | 30 | 58 | 34% |
Accounting for Heat Transfer Problems in the Semiconductor Industry | 2009 | 1 | 18 | 44% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | MICROELECT COMP SCI | 5 | 24% | 2.2% | 19 |
2 | ELE ON DEVICES | 4 | 18% | 2.4% | 21 |
3 | MINIST EDUC CHINA DESIGN ELE OMAG | 2 | 67% | 0.2% | 2 |
4 | CMOS PLATFORM DEVICE DEV | 1 | 50% | 0.2% | 2 |
5 | J ANESE ASSOCIATE DEGREE PROGRAM | 1 | 50% | 0.2% | 2 |
6 | MNT DEE | 1 | 100% | 0.2% | 2 |
7 | PHYS ELE OTECHNOL | 1 | 14% | 0.8% | 7 |
8 | AUTOMAT DR | 1 | 33% | 0.2% | 2 |
9 | ASSEMBLY TEST | 1 | 50% | 0.1% | 1 |
10 | AUTOMAT CONTROL LA | 1 | 50% | 0.1% | 1 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000261293 | MARINE ELECT//KATEDRA ELEKT MORSKIEJ//SELFHEATING |
2 | 0.0000131462 | JUNCTION TEMPERATURE//PHOSPHOR IN GLASS//ANGULAR COLOR UNIFORMITY |
3 | 0.0000122838 | PLATE FIN HEAT SINK//PIN FINS//HEAT SINK |
4 | 0.0000106395 | THROUGH SILICON VIA TSV//3 D INTEGRATION//KEEP OUT ZONE KOZ |
5 | 0.0000101657 | THERMAL ENGN TECHNOL//J AN MARINE SCI TECHNOL//INP WAFERS |
6 | 0.0000100364 | POWER CAPPING//ANALYTICAL PERFORMANCE MODELS//CONSERVATION CORE |
7 | 0.0000079842 | INSULATED GATE BIPOLAR TRANSISTOR IGBT//LATERAL INSULATED GATE BIPOLAR TRANSISTOR LIGBT//INSULATED GATE BIPOLAR TRANSISTORS IGBTS |
8 | 0.0000077261 | INTRINSIC VERIFICATION//STRUCT ENGN BLDG PHYS//LAMINATE APPROXIMATION THEORY |
9 | 0.0000074209 | SUBSTRATE NOISE//SUBSTRATE COUPLING//POWER SUPPLY NOISE |
10 | 0.0000071150 | THERMAL CONTACT CONDUCTANCE//THERMAL CONTACT RESISTANCE//MOVING HEAT SOURCES |