Class information for:
Level 1: ANISOTROPIC CONDUCTIVE ADHESIVE ACA//ANISOTROPIC CONDUCTIVE FILM ACF//ANISOTROPIC CONDUCTIVE FILM

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
11060 945 19.0 52%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
688 12395 LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 ANISOTROPIC CONDUCTIVE ADHESIVE ACA Author keyword 58 92% 2% 23
2 ANISOTROPIC CONDUCTIVE FILM ACF Author keyword 54 72% 5% 43
3 ANISOTROPIC CONDUCTIVE FILM Author keyword 31 66% 3% 29
4 ELECTRICALLY CONDUCTIVE ADHESIVES ECAS Author keyword 23 100% 1% 10
5 CONDUCTIVE ADHESIVES Author keyword 23 54% 3% 30
6 ELECTRICALLY CONDUCTIVE ADHESIVES Author keyword 23 56% 3% 28
7 ANISOTROPIC CONDUCTIVE ADHESIVE Author keyword 18 53% 2% 23
8 ELECTRONICALLY CONDUCTIVE ADHESIVES Author keyword 17 79% 1% 11
9 CONDUCTIVE ADHESIVE Author keyword 16 39% 3% 32
10 CHIP ON GLASS COG Author keyword 15 63% 2% 15

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 ANISOTROPIC CONDUCTIVE ADHESIVE ACA 58 92% 2% 23 Search ANISOTROPIC+CONDUCTIVE+ADHESIVE+ACA Search ANISOTROPIC+CONDUCTIVE+ADHESIVE+ACA
2 ANISOTROPIC CONDUCTIVE FILM ACF 54 72% 5% 43 Search ANISOTROPIC+CONDUCTIVE+FILM+ACF Search ANISOTROPIC+CONDUCTIVE+FILM+ACF
3 ANISOTROPIC CONDUCTIVE FILM 31 66% 3% 29 Search ANISOTROPIC+CONDUCTIVE+FILM Search ANISOTROPIC+CONDUCTIVE+FILM
4 ELECTRICALLY CONDUCTIVE ADHESIVES ECAS 23 100% 1% 10 Search ELECTRICALLY+CONDUCTIVE+ADHESIVES+ECAS Search ELECTRICALLY+CONDUCTIVE+ADHESIVES+ECAS
5 CONDUCTIVE ADHESIVES 23 54% 3% 30 Search CONDUCTIVE+ADHESIVES Search CONDUCTIVE+ADHESIVES
6 ELECTRICALLY CONDUCTIVE ADHESIVES 23 56% 3% 28 Search ELECTRICALLY+CONDUCTIVE+ADHESIVES Search ELECTRICALLY+CONDUCTIVE+ADHESIVES
7 ANISOTROPIC CONDUCTIVE ADHESIVE 18 53% 2% 23 Search ANISOTROPIC+CONDUCTIVE+ADHESIVE Search ANISOTROPIC+CONDUCTIVE+ADHESIVE
8 ELECTRONICALLY CONDUCTIVE ADHESIVES 17 79% 1% 11 Search ELECTRONICALLY+CONDUCTIVE+ADHESIVES Search ELECTRONICALLY+CONDUCTIVE+ADHESIVES
9 CONDUCTIVE ADHESIVE 16 39% 3% 32 Search CONDUCTIVE+ADHESIVE Search CONDUCTIVE+ADHESIVE
10 CHIP ON GLASS COG 15 63% 2% 15 Search CHIP+ON+GLASS+COG Search CHIP+ON+GLASS+COG

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 BONDING PARAMETERS 30 69% 3% 25
2 ANISOTROPIC CONDUCTIVE FILM 25 70% 2% 21
3 RELIABILITY PERFORMANCE 20 58% 2% 23
4 FLIP CHIP 18 20% 9% 81
5 FLEX PACKAGES 17 68% 2% 15
6 CONDUCTIVE ADHESIVE INTERCONNECTS 15 82% 1% 9
7 ANISOTROPICALLY CONDUCTIVE ADHESIVE 12 63% 1% 12
8 FUSIBLE FILLER 12 86% 1% 6
9 NONCONDUCTIVE ADHESIVES 11 67% 1% 10
10 CONDUCTIVE ADHESIVE 11 57% 1% 13

Journals


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 JOURNAL OF ELECTRONICS MANUFACTURING 2 12% 2% 18

Reviews


Title Publ. year Cit. Active
references		 % act. ref.
to same field
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications 2006 293 43 70%
A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications 2008 53 76 86%
Recent advances in isotropic conductive adhesives for electronics packaging applications 2008 63 44 59%
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging 2008 41 66 77%
New insights into silver nanowires filled electrically conductive adhesives 2015 1 16 81%
Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications 2008 10 60 90%
Electrically conductive adhesives with a focus on adhesives that contain carbon nanotubes 2013 7 94 36%
Adhesive bonding in microelectronics and photonics 2002 45 34 12%
MECHANICAL PROBLEMS IN THE PRODUCTION PROCESS OF SEMICONDUCTOR-DEVICES 1990 1 9 11%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 KEY STATE NEW DISPLAYS SYST PLICAT 10 58% 1.2% 11
2 NSF PACKAGING 6 80% 0.4% 4
3 ELECT PROD 6 36% 1.5% 14
4 NANO PACKAGING INTERCONNECT 5 63% 0.5% 5
5 MODULES COMPONENTS 4 75% 0.3% 3
6 AUTOMAT MECH ENGN 4 28% 1.2% 11
7 NTNU NANOMECH 3 37% 0.7% 7
8 SMIT 3 15% 1.7% 16
9 MICROSYST MODULES COMPONENTS 2 32% 0.6% 6
10 ELECT PACKAGING THIN FILM 2 50% 0.3% 3

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000117743 INNER LEAD BONDING ILB//INNER LEAD BONDING//LASER SOLDERING
2 0.0000108861 UNDERFILL FLOW//WIRE SWEEP//BUMP PITCH
3 0.0000098913 NANOSCALE SILVER PASTE//NANOSILVER PASTE//TIANJIN ADV JOINING TECHNOL
4 0.0000071559 WIRE BONDING//ULTRASONIC WEDGE BONDING//MICROJOINING
5 0.0000065900 JOURNAL OF ELECTRONIC PACKAGING//SOLDERING & SURFACE MOUNT TECHNOLOGY//SOLDER JOINT
6 0.0000064231 INK JET PRINTING//PRINTED ELECTRONICS//CONDUCTIVE INK
7 0.0000063644 ELECT MFG ENGN GRP//SOLDER PASTE//PCBA REWORK
8 0.0000049910 FLUXLESS BONDING//AU SN SOLDER//MAT MFG TECHNOL PROGRAM
9 0.0000046508 CONDUCTIVE POLYMER COMPOSITES//CONDUCTIVE POLYMER COMPOSITE//PTC EFFECT
10 0.0000046434 ST S ANAL FAILURE DESIGN//FRETTING CORROSION//TIN PLATED CONTACT