Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
11034 | 948 | 19.6 | 54% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
1317 | 8022 | ELECT DEVICES MAT TECHNOL//PLASMA ETCHING//SIO2 ETCHING |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | RUN TO RUN CONTROL | Author keyword | 38 | 51% | 6% | 54 |
2 | IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | Journal | 28 | 13% | 21% | 197 |
3 | AUTOMATIC VIRTUAL METROLOGY AVM | Author keyword | 18 | 89% | 1% | 8 |
4 | AVERAGE ADJUSTMENT INTERVAL | Author keyword | 18 | 89% | 1% | 8 |
5 | VIRTUAL METROLOGY | Author keyword | 17 | 47% | 3% | 27 |
6 | VIRTUAL METROLOGY VM | Author keyword | 14 | 64% | 1% | 14 |
7 | RUN TO RUN R2R CONTROL | Author keyword | 12 | 75% | 1% | 9 |
8 | PROCESS ADJUSTMENT | Author keyword | 9 | 52% | 1% | 12 |
9 | EWMA CONTROLLER | Author keyword | 8 | 75% | 1% | 6 |
10 | RUN TO RUN PROCESS CONTROL | Author keyword | 8 | 75% | 1% | 6 |
Web of Science journal categories |
Author Key Words |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | RUN TO RUN CONTROL | 38 | 51% | 6% | 54 | Search RUN+TO+RUN+CONTROL | Search RUN+TO+RUN+CONTROL |
2 | AUTOMATIC VIRTUAL METROLOGY AVM | 18 | 89% | 1% | 8 | Search AUTOMATIC+VIRTUAL+METROLOGY+AVM | Search AUTOMATIC+VIRTUAL+METROLOGY+AVM |
3 | AVERAGE ADJUSTMENT INTERVAL | 18 | 89% | 1% | 8 | Search AVERAGE+ADJUSTMENT+INTERVAL | Search AVERAGE+ADJUSTMENT+INTERVAL |
4 | VIRTUAL METROLOGY | 17 | 47% | 3% | 27 | Search VIRTUAL+METROLOGY | Search VIRTUAL+METROLOGY |
5 | VIRTUAL METROLOGY VM | 14 | 64% | 1% | 14 | Search VIRTUAL+METROLOGY+VM | Search VIRTUAL+METROLOGY+VM |
6 | RUN TO RUN R2R CONTROL | 12 | 75% | 1% | 9 | Search RUN+TO+RUN+R2R+CONTROL | Search RUN+TO+RUN+R2R+CONTROL |
7 | PROCESS ADJUSTMENT | 9 | 52% | 1% | 12 | Search PROCESS+ADJUSTMENT | Search PROCESS+ADJUSTMENT |
8 | EWMA CONTROLLER | 8 | 75% | 1% | 6 | Search EWMA+CONTROLLER | Search EWMA+CONTROLLER |
9 | RUN TO RUN PROCESS CONTROL | 8 | 75% | 1% | 6 | Search RUN+TO+RUN+PROCESS+CONTROL | Search RUN+TO+RUN+PROCESS+CONTROL |
10 | RUN TO RUN CONTROLLER | 6 | 80% | 0% | 4 | Search RUN+TO+RUN+CONTROLLER | Search RUN+TO+RUN+CONTROLLER |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | EWMA CONTROLLER | 65 | 84% | 4% | 36 |
2 | RUN PROCESS CONTROL | 46 | 78% | 3% | 31 |
3 | TO RUN CONTROL | 28 | 62% | 3% | 29 |
4 | METROLOGY DELAY | 27 | 92% | 1% | 11 |
5 | DOUBLE EWMA CONTROLLER | 17 | 100% | 1% | 8 |
6 | CATEGORICAL OBSERVATIONS | 12 | 86% | 1% | 6 |
7 | COMBINING SPC | 12 | 86% | 1% | 6 |
8 | H 2 WF6 | 9 | 83% | 1% | 5 |
9 | LOW DAMAGE | 9 | 83% | 1% | 5 |
10 | SEMICONDUCTOR MANUFACTURING PROCESSES | 7 | 50% | 1% | 10 |
Journals |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | 28 | 13% | 21% | 197 |
Reviews |
Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
---|---|---|---|---|
Automatic control in microelectronics manufacturing: Practices, challenges, and possibilities | 2000 | 122 | 59 | 58% |
Run-to-run process control: Literature review and extensions | 1997 | 100 | 14 | 50% |
Estimation and Control in Semiconductor Etch: Practice and Possibilities | 2010 | 7 | 93 | 73% |
Run-to-run control and state estimation in high-mix semiconductor manufacturing | 2007 | 9 | 5 | 80% |
A Literature Review on Sampling Techniques in Semiconductor Manufacturing | 2013 | 2 | 15 | 33% |
A review of SiC reactive ion etching in fluorinated plasmas | 1997 | 79 | 84 | 21% |
Data analytics and stochastic modeling in a semiconductor fab | 2010 | 3 | 3 | 33% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | NISHI YODOGAWA KU | 4 | 75% | 0.3% | 3 |
2 | ENGN ADV ELECT MAT PROC | 3 | 100% | 0.3% | 3 |
3 | MFG INFORMAT SYST | 3 | 15% | 1.8% | 17 |
4 | MICROMECHATRON | 2 | 38% | 0.5% | 5 |
5 | ADV MICROELECT TECHNOL | 2 | 67% | 0.2% | 2 |
6 | AUTOMATED PRECIS MFG | 2 | 67% | 0.2% | 2 |
7 | CIMOS | 2 | 67% | 0.2% | 2 |
8 | IND MANAGEMENT BUSINESS ADM | 2 | 43% | 0.3% | 3 |
9 | LARGE SCALE INTEGRAT | 1 | 100% | 0.2% | 2 |
10 | CONTROL GUIDANCE TECHNOL | 1 | 33% | 0.3% | 3 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000094435 | RAPID THERMAL PROCESSING RTP//RAPID THERMAL PROCESSING//CTOD FRACTURE TOUGHNESS TESTING |
2 | 0.0000077114 | SECCIO INTELLIGENCIA ARTIFICIAL//INTEGRATED SENSORY INTELLIGENT SYSTEM//ALTANA CHAIR BIOINFORMAT INFORMAT MIN |
3 | 0.0000073044 | ELLIPSOIDAL TECHNIQUE//DESIGN CENTERING//PARAMETRIC YIELD |
4 | 0.0000072876 | ELECT DEVICES MAT TECHNOL//SIO2 ETCHING//PLASMA ETCHING |
5 | 0.0000071322 | AVERAGE RUN LENGTH//STATISTICAL PROCESS CONTROL//CONTROL CHARTS |
6 | 0.0000050089 | VACUUM TECHNOL//ACTIVE PLASMA RESONANCE SPECTROSCOPY//CUTOFF PROBE |
7 | 0.0000049769 | CHEMICAL DRY ETCHING//PLASMA NANOTECHNOL PLANT//AFTER CORROSION |
8 | 0.0000046448 | WET ETCHING OF GLASS//DEEP GLASS ETCHING//TECH SUPPORT MACHINERY MET IND |
9 | 0.0000046032 | OPTICAL SCATTEROMETRY//DIMENSIONAL STANDARDS//LINEWIDTH MONITORING |
10 | 0.0000044817 | WAFER FABRICATION//IND ENGN SYST MANAGEMENT//FUZZY BACK PROPAGATION NETWORK |